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During this year’s IPFA conference we are excited to present a new paper with our customer Infineon Technologies ‘𝘙𝘦𝘷𝘰𝘭𝘶𝘵𝘪𝘰𝘯𝘪𝘻𝘪𝘯𝘨 𝘐𝘊 𝘗𝘢𝘤𝘬𝘢𝘨𝘦 𝘋𝘦𝘤𝘢𝘱𝘴𝘶𝘭𝘢𝘵𝘪𝘰𝘯 𝘸𝘪𝘵𝘩 𝘔𝘪𝘤𝘳𝘰𝘸𝘢𝘷𝘦-𝘐𝘯𝘥𝘶𝘤𝘦𝘥-𝘗𝘭𝘢𝘴𝘮𝘢 (𝘔𝘐𝘗) 𝘚𝘺𝘴𝘵𝘦𝘮’, demonstrating new solutions to the industries challenges with preserving the Nickel-plating layer on the lead finger for repackaging, preservation of Cu wires in Film Over Wire (FOW) stacked-die device decapsulation. Failure analysis involves a series of steps to identify the root cause of a failed semiconductor IC. Current methods like acid or laser etching often damage these

Radiation testing of semiconductors is crucial for devices used in environments with high radiation exposure, such as space or nuclear facilities. Understanding how radiation impacts your product is essential for reliability and performance. Decapsulation is necessary in radiation effects studies for semiconductors to expose the active die and allow for detailed testing & analysis of the radiation’s effects to the device. This is crucial for understanding how radiation alters

With significant momentum as the next breakthrough in semiconductor technology, the advanced packaging industry is experiencing rapid growth.We’re excited to announce that another leader in advanced packaging has selected our MIP technology to support their continued growth. As demonstrated in our recent plublications on advanced packaging, the MIP machine is invaluable for AI and advanced

Team JIACO Instruments recently visited the DIFFER facility in Eindhoven as part of our ongoing collaboration. We kicked off the day with a productive team meeting reflecting on the year so far and making exciting plans for the future. Xingyu Chen then gave us an inspiring tour of the facility where we collaborate on fundamental plasma research. The

Semiconductor decapsulation has always been done with acid. But semiconductors are changing: they’re more delicate, more complex, more powerful. And decapsulation methods have to adapt — or risk rendering samples useless by wiping out the evidence at failure sites.   The reality is, acid isn’t fit for purpose anymore. It’s not selective or refined enough to give your

Semiconductor decapsulation is an increasingly challenging, delicate and time-pressured process. Acid has been the go-to for all labs — but it’s no longer a future-proof approach. The market is demanding more nuanced results than traditional acid decapsulation can deliver.   Here, we’ll explore the trends combining to knock acid decapsulation off its dominant spot.   More IOs