Why look for an alternative decapsulation method?
Decapsulating semiconductor devices has become increasingly challenging due to constantly changing materials, new bond-wire types and the growing complexity of package architectures. With one-off failures, highly valuable “golden samples” and stricter quality requirements, the industry needs a process that meets rising customer expectations.
What does a good decapsulation process need?
Traditional methods such as wet chemical or acid etching can introduce artefacts, damage devices or destroy original failure sites, making subsequent failure analysis unreliable.
- High process selectivity
- Preservation of samples and original failure sites
- Fully automated operation
Discover MIP Decapsulation
Discover how our MIP technology delivers the selectivity and reliability required for advanced semiconductor packages.
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Our Microwave Induced Plasma (MIP) Systems
Leader in Plasma Decapsulation Technology
JIACO Instruments has published more than 30 papers on MIP and plasma research. Our patented MIP technology provides non-destructive decapsulation that preserves copper and silver wire integrity. Supported by a global service team, we provide fast response times and a high level of personal application support to customers worldwide.
- 30+ peer-reviewed publications
- JEDEC industry standard
- Excellent application support
Revolutionizing IC Package Decapsulation with Microwave-Induced-Plasma (MIP) System
Preserving the electrical functionality of devices is critical for many failure analysis workflows. When wire damage or rebonding failures cause a breakdown of the electrical
Semiconductor Decapsulation For Failure Analysis
Get it right the first time
Why plasma over acid decapsulation?
Discover the new industry standard for semiconductor failure analysis.